By Thomson Reuters
Publication Date: 2026-02-26 14:02:00
By Max A. Cherney
SAN JOSE, California, Feb 26 (Reuters) – Artificial intelligence chip designer Broadcom said that it expects to sell at least 1 million chips by 2027 based on its stacked design tech, an executive told Reuters on Wednesday.
The forecast, which Reuters is the first to report, marks a new product and sales target for Broadcom that could represent a revenue stream potentially worth billions of dollars.
Harish Bharadwaj, vice president of product marketing, said the 1 million chips the company projects it will sell are based on an approach Broadcom developed that stacks two chips on top of one another, allowing the distinct pieces of silicon to be tightly bound to improve the speed at which data can flow from one chip to another.
The company has refined the technology over five years to the point where its first customer, Fujitsu, is making engineering samples to test the design. Fujitsu plans to produce the stacked, or 3D, chips later this year.
The…