Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

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Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

TEMPE, Ariz., May 20, 2025 (GLOBE NEWSWIRE) — Deca Technologies today announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont,…

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https://www.globenewswire.com/news-release/2025/05/20/3084597/0/en/Deca-Announces-Agreement-with-IBM-to-Bring-High-Density-Fan-Out-Interposer-Production-to-North-America.html

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