Glass core substrates (GCS) are expected to be essential in the advanced packaging of upcoming chip technologies. Companies in the semiconductor supply chain in Japan and South Korea are increasing their focus on developing GCS solutions or acquiring relevant companies to stay competitive in the market.
Semiconductor players in both Japan and South Korea are recognizing the importance of GCS in enhancing the performance and capabilities of next-generation chips. By utilizing GCS, companies can improve the thermal conductivity and reduce the overall size of the chip package, leading to more efficient and powerful electronic devices.
The development of GCS is seen as a strategic investment for companies looking to maintain their position in the semiconductor industry. By being at the forefront of GCS technology, these companies can offer cutting-edge solutions to meet the demands of the rapidly evolving market.
Japanese and South Korean companies are not only focusing on developing GCS internally but also looking to acquire businesses that specialize in GCS technology. This approach allows them to quickly expand their capabilities and expertise in this critical area, ensuring they can meet the growing demand for advanced packaging solutions.
Overall, the semiconductor supply chain in Japan and South Korea is actively investing in GCS technology to stay ahead in the competitive market. By developing innovative solutions and acquiring relevant companies, these players are positioning themselves for success in the era of next-generation chips.
Article Source
https://www.digitimes.com/news/a20240705PD205/packaging-intel-technology-2024-2023.html
