Siemens Digital Industries Software and Intel Foundry have announced a new collaboration that has resulted in the certification of a new Electronic Design Automation (EDA) product and an integrated multi-die interconnect bridge (EMIB). The partnership aims to help mutual customers leverage the benefits of 3D-IC designs more efficiently, including performance, space, and power efficiency advantages.
The certified product, Siemens’ Solido™ SPICE, is part of the Solido™ Simulation Suite software designed for Intel 16 and Intel 18A nodes. This advanced portfolio of AI-accelerated simulators offers circuit verification for analog, mixed signal, RF, memory, IP library, 3D-IC, and systems design. Intel 18A features RibbonFET all-gate transistor architecture (GAA) and PowerVia rear power delivery technologies, ideal for high-performance computing, mobile applications, and other fast-growth applications. Intel 18A and Intel 16 now support the Open Model Interface (OMI) platform for aging modeling and reliability analysis, backed by Siemens’ Solido Simulation Suite.
Amit Gupta, VP and GM of custom IC verification at Siemens, emphasized the commitment to providing customers with advanced technologies for complex IC design and packaging. Siemens also introduced the EMIB reference stream, allowing early Intel Foundry customers to leverage the integrated multi-die interconnect bridge approach for connecting high-density heterogeneous chips.
Customers can utilize Siemens’ Xpedition tools for substrate and package system planning, design, and verification. The collaboration aims to push the boundaries of semiconductor innovation and enable IC design companies to innovate complex ICs for various electronics applications.
For more information about Siemens’ offerings in the IC design industry, visit Siemens Digital Industries Software’s website. The company aims to help organizations digitally transform their design and manufacturing processes through software, hardware, and services from the Siemens Xcelerator business platform.
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