High performance computing faces a significant challenge in connectivity bandwidth, with data currently needing to be moved off-chip to optical interfaces for high-speed transfers and longer distances. However, incorporating the optical connection within a chip package offers advantages such as a reduced footprint, higher performance, and lower power requirements. This is crucial for applications like artificial intelligence and machine learning (AI/ML) large language models (LLM) as well as military and avionics applications like phased array radar that rely heavily on high performance computing and large data processing.
The Intel chiplet being discussed incorporates 64 bidirectional channels running at 32 Gb/s for a total bandwidth of 4 Tb/s. It utilizes a hybrid laser-on-wafer and direct integration technology, leveraging eight pairs of fibers with each pair carrying eight wavelengths of dense wavelength division multiplexing (DWDM). The OCI transmitters in the chiplet can connect up to 100 meters of fiber optic cable, making it suitable for both off-board and on-board connections. The connection protocol is compatible with PCIe Gen5, and the chiplet demonstrates high signal quality with low power consumption compared to off-chip solutions like plug-in optical transceiver modules.
Intel’s decision to put OCI on a chiplet is part of a broader strategy that allows for flexibility in combining different chiplets like GPUs, IPUs, or AI/ML accelerators. The Universal Chiplet Interconnect Express (UCIe) standard chiplet interface makes it easy to link chiplets together, enabling high-speed interconnections within a chiplet-based platform. While data centers can benefit from 4Tb/s connections, OCI chiplets can also be useful in military, avionics, and other embedded applications that require high-speed, low-power connections for processing large volumes of sensor data in real-time.
Overall, incorporating OCI into a chiplet offers significant advantages in terms of performance, power efficiency, and flexibility in designing chip-based solutions for various applications beyond just data centers. The integration of optical connections within a chip package is a promising development that could revolutionize the way high performance computing is implemented in various industries.
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https://www.electronicdesign.com/technologies/eda/article/55091682/electronic-design-intels-oci-compatible-chiplet-provides-64-optical-channels-that-deliver-4-tb-s