Seoul, South Korea- SK Group Chairman Chey Tae-won recently met with top executives from global technology giants, Amazon and Intel, to discuss potential collaboration in the field of artificial intelligence (AI) semiconductors. Chey’s visit to the United States included talks with Amazon CEO Andy Jassy and Intel CEO Pat Gelsinger, where they explored ways to enhance cooperation in the AI chip sector.
Amazon has introduced its own AI chips, Trainium and Inferentia, as part of its strategy to expand its business offerings to include AI chip design and services. The company is a key customer of SK Hynix, a leading provider of high-bandwidth memory (HBM) for AI semiconductors. SK Hynix recently launched its fifth-generation product, HBM3E, which has garnered significant interest in the market.
During the meeting with Intel’s CEO, Chey and Gelsinger highlighted the longstanding partnership between SK Hynix and Intel, discussing future technological advancements and potential collaborations in the AI chip sector. In a previous joint effort, SK Hynix and Intel developed the fastest DRAM for servers, the DDR5 multiplexer-matched dual-rank inline memory module.
In addition to these meetings, Chey also engaged with other tech leaders, including OpenAI’s Sam Altman and Microsoft’s Satya Nadella. SK Group unveiled a reform plan to secure 80 trillion won (US$58 billion) by 2026 to increase investments in AI and semiconductors, aligning with industry trends driven by AI advancements.
The discussions and collaborations with Amazon, Intel, and other tech firms reflect SK Group’s commitment to staying at the forefront of technological innovation and leveraging partnerships to drive growth in the AI sector.
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Overall, Chey’s meetings with industry leaders highlight SK Group’s strategic focus on AI and semiconductor investments, positioning the company for future growth and technological advancements in the global market.
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https://menafn.com/1108392233/SK-Group-Chairman-Meets-With-Ceos-Of-Amazon-Intel
