SK Group Chairman Chey Tae-won recently traveled to the United States to meet with key leaders in the tech industry, such as Amazon CEO Andy Jassy and Intel CEO Pat Gelsinger, to discuss enhancing business cooperation in the field of artificial intelligence (AI) semiconductors. During his visit, Chey explored avenues for collaboration with Amazon in the AI chip sector, particularly in light of Amazon’s recent unveiling of its own AI chips, Trainium and Inferentia.
SK Group highlighted Amazon as one of SK Hynix’s customers for high-bandwidth memory (HBM), an essential component for AI semiconductors. SK Hynix is a leader in the HBM market with its latest fifth-generation HBM3E product. Chey also held discussions with Intel’s CEO, celebrating the strong partnership between SK Hynix and Intel and exchanged views on future technologies and business collaborations in the AI chip sector. The two companies previously collaborated on developing the fastest DRAM for servers, the DDR5 multiplexer mixed-rank dual inline memory module, in December 2022, with SK Hynix’s DDR5 server product receiving approval for Intel’s fourth-generation processor last year.
In addition to his meetings with Amazon and Intel, Chey also met with other prominent figures in the tech industry, including OpenAI’s Sam Altman and Microsoft’s Satya Nadella. It was reported that during these discussions, they exchanged ideas on industry trends and potential opportunities for collaboration. SK Group announced a reform plan to secure 80 trillion won (US$58 billion) by 2026 to bolster investment in AI and semiconductors, aligning with the company’s strategy to adapt to the evolving landscape of AI-led industries.
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