Cadence Design Systems, Inc. has announced significant achievements in its partnership with Intel Foundry, specifically in enabling 3D-IC, EDA flows, and IP development across various process nodes. This collaboration includes the availability of a complete 2.5D Embedded Multi-die Interconnect Bridge advanced packaging flow (EMIB) for Intel 18A technology, enhancements to digital and custom/analog streams, a wide IP portfolio, and process design kits (PDKs) across multiple process nodes.
One key milestone of the partnership is the EMIB Reference Flow, which integrates Cadence’s Integrity™ 3D-IC platform with Intel’s EMIB technology to enable seamless heterogeneous full-flow designs. Another achievement is the certification and optimization of Cadence’s RTL to GDS full stream for Intel 18A technology, which includes various AI-powered tools for chip design. The Custom/Analog Flow for Intel 18A has also been certified, with support from Cadence’s Virtuoso Studio and Spectre® simulation platform.
Cadence has also developed Design IP for Intel 18A, including implementations for high-performance computing and AI/ML applications. This IP portfolio includes PCIe 6.0, Compute Express Link, multi-standard PHY for memory applications, and Universal Chiplet Interconnect Express™ for multi-die systems. These offerings aim to accelerate time to market for customers utilizing Intel Foundry’s advanced silicon technologies.
Tom Beckley, senior vice president at Cadence, highlighted the partnership’s success in driving innovation for AI-enabled electronics and semiconductor systems. He emphasized the importance of the EMIB advanced packaging flow and other milestones in delivering next-generation system solutions. Suk Lee, vice president at Intel Foundry, also praised Cadence’s AI-powered EDA solutions and IP technology, saying they are essential for co-design and optimization efforts.
Overall, the collaboration between Cadence and Intel Foundry is focused on addressing the challenges of system-level exploration and optimization, with a goal of being a leading systems foundry for the AI era. The partnership’s achievements demonstrate a strong commitment to advancing technology and delivering innovative solutions for complex electronic systems.
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