Broadcom Inc. AVGO announced significant advancements in its co-packaged optics (CPO) technology on Thursday, with the launch of its third-generation 200G per lane (200G/lane) CPO product line.
Broadcom highlighted key improvements in OSAT processes, thermal designs, handling procedures, fiber routing, and overall yield.
Broadcom’s leadership in CPO began in 2021 with its first-generation Tomahawk 4-Humboldt chipset, enabling an early learning cycle across the entire…
Article Source
https://www.communicationstoday.co.in/broadcom-unveils-next-gen-optical-chip-tech-to-power-ai-data-centers/
