By Amy Fan, Taipei; Charlene Chen, DIGITIMES Asia
Publication Date: 2025-12-05 05:03:00
Samsung Electronics has reportedly passed quality verification for its high-bandwidth memory (HBM) used in Alphabet’s next-generation AI chip, the Tensor Processing Unit (TPU), and secured supply contracts through 2026. Alongside existing HBM3E supplies, Samsung expects its 2026 orders to grow more than threefold compared to 2025.
