Intel is said to be working on a new LGA1851 socket for its upcoming Arrow Lake processors, aiming to address the thermal throttling issues seen in previous generations. The new socket is rumored to feature two load-reducing mechanisms: a standard one similar to the current LGA1700 socket and a new “Reduced Load ILM” (RL-ILM) specifically catering to enthusiasts seeking better cooling performance.
The LGA1851 socket is expected to be used for the 15th Gen Arrow Lake CPU, with reports indicating that DDR4 support may be dropped in favor of enhanced overclocking capabilities. The ILM, which secures the CPU into the motherboard socket and ensures proper contact with the CPU cooler, plays a crucial role in CPU cooling. Previous generations using the LGA1700 socket have faced issues with the ILM design, causing CPUs to bend slightly over time and disrupt contact with the heatsink, leading to higher temperatures and potential damage.
The new RL-ILM design for the LGA1851 socket is said to be an optional upgrade for motherboard manufacturers, with a minimal estimated cost difference of just $1. This cost-effective solution may encourage manufacturers to adopt the high-performance option for mid- and high-end motherboards. While the exact specifications of the RL-ILM are not yet known, it is expected to focus on improving thermal performance compared to the standard options available.
To address the bending issue seen in previous ILM designs, Intel may incorporate a less aggressive design for the RL-ILM on the LGA1851 socket. This design would distribute contact points across a wider surface of the CPU’s integrated heatsink, reducing the risk of curvature and improving thermal performance. Although these details are based on leaked information and not officially confirmed by Intel, the potential introduction of the RL-ILM could mark a significant improvement for enthusiasts and enhance thermal management on future Intel processors.
In conclusion, Intel’s rumored development of the LGA1851 socket with the optional RL-ILM presents a promising solution to address thermal throttling issues and improve cooling performance for Arrow Lake processors. While the specifics of the RL-ILM design are still unknown, the potential benefits for overclockers and enthusiasts indicate a positive step forward in CPU cooling technology. Keep an eye out for official announcements from Intel to confirm these rumors and see how the new socket may impact the performance of future processors.
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https://www.pcguide.com/news/intels-new-lga1851-socket-should-make-overclockers-happy-thanks-to-better-thermal-design/
