The 3D scanner for face recognition The “iPhone 13” is expected to get up to 50% smaller, which could result in a lower notch, according to supply chain sources.
There have been a number of rumors and reports suggesting Apple’s Face ID sensor array may be received smaller in size. When the sensors can be hidden behind the display or reduced, then the notch itself also becomes smaller.
Now a new industry report from Digitimes claims Apple could Cut the die size for its VCSEL chips, which are used for 3D face ID scanning, by up to 50%. This would be used in “new iPhone and iPad devices to be launched later in 2021”.
Vertical cavity surface-emitting laser, or VCSEL, is a sensor used to spray infrared spots over a surface to obtain a 3D depth map. The report suggests that Apple is reducing the size of the chip that is only used in Face ID, but the same type of chip is being used for LiDAR on the back of iPhones and iPads.
The reduction in notch size has been rumored every year since the year iPhone X. announced that it will introduce the Face ID system. Dummy models and schematic leaks Make notch reduction more likely than ever for iPhone 2021.
Digitimes has a strong track record for industry sources, albeit a much weaker track record for correctly deducing its information.
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