Apple and Broadcom job listings suggest potential Intel Foundry collaborations — requirements highlight expertise in Intel’s EMIB and 2.5D memory packaging tech

A few months ago, we reported that Intel and Apple were reportedly in preliminary discussions to find ways to collaborate with each other. But since then, there have been no details on what type of collaboration the two companies might be cooking up, until now. An Apple job listing for “DRAM Packaging Engineer” has cropped up, mentioning EMIB and 2.5D, suggesting Apple could partner with Intel to package its future processor designs, similar to Nvidia. This new posting also follows similar job listings from Broadcom, suggesting that Intel’s packaging services may soon be flush with new customers with massive output needs.

The person who inevitably assumes this new role will be responsible for making the best choices about how Apple should develop future memory packaging designs for its own chips. The role will also require the person to partner with memory vendors to develop a roadmap for future 2.5D/3D packaging components.