Ansys has teamed up with Intel to develop thermal management technology for the Intel 18A silicon process, which will be crucial for supporting high-performance computing, graphics, and AI products for US national security applications. The collaboration involves Ansys joining the Intel Foundry Accelerator US Military, Aerospace, and Government Alliance (USMAG) to provide secure design flows and methodologies tailored for US security applications.
Ansys is enhancing its technical partnership with Intel Foundry by optimizing the Ansys Redhawk-SC platform to deliver a comprehensive thermal management flow for Intel 18A advanced process technology. This technology will enable the design of reliable, high-performance chips capable of meeting the stringent requirements of military, aerospace, and government applications. Additionally, Ansys and Intel Foundry are working together to verify the thermal and power integrity, as well as mechanical reliability, of Intel’s integrated multi-die interconnect bridge (EMIB) assembly technology.
John Lee, vice president and general manager of Ansys’ Electronics, Semiconductor, and Optics business unit, highlighted Ansys’ expertise in addressing complex multiphysics challenges and meeting stringent thermal, power, mechanical, and reliability requirements. This collaboration aims to deliver greater value to customers in the military and aerospace sectors. Suk Lee, vice president and general manager of Intel Foundry’s ecosystem technology office, welcomed Ansys as a valuable addition to the USMAG Alliance, emphasizing the importance of robust design and simulation capabilities for developing semiconductor solutions with cutting-edge process capabilities.
Ansys, with a mission to drive innovation that advances human progress, has been a key player in enabling companies to bridge the gap between design and reality through simulation for over 50 years. The predictive power of Ansys software has empowered innovators across various industries to push boundaries and drive human advancement through technologies like sustainable transportation, advanced semiconductors, satellite systems, and medical devices.
All in all, Ansys’ collaboration with Intel to develop thermal management technology for the Intel 18A silicon process is crucial for enabling high-performance computing, graphics, and AI products to support US national security applications. The optimized thermal management flow developed by Ansys will assist in designing reliable and secure chips that meet the specific requirements of military, aerospace, and government applications. This partnership demonstrates Ansys’ commitment to driving innovation and supporting advancements in technology for the betterment of society.
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