Ansys and Intel are collaborating to develop thermal management technology for the Intel 18A silicon process, which will support high-performance computing, graphics, and artificial intelligence products for US national security applications. Ansys has joined Intel Foundry Accelerator’s US Military, Aerospace, and Government Alliance (USMAG) to provide secure design methodologies and flows for US security applications. The collaboration includes optimizing Ansys Redhawk-SC™ to deliver a comprehensive thermal management flow for Intel 18A advanced process technology.
Ansys is enhancing its technical collaboration with Intel Foundry by improving its RedHawk-SC platform to support the Intel 18A silicon manufacturing process. This process includes PowerVia technology, which presents challenges for cooling circuits, especially for high-performance computing, AI, and graphics processor chips. Ansys’ thermal resolution technology offers predictive accuracy and system-wide analysis capabilities, resulting in improved performance and design flexibility.
Furthermore, Intel Foundry and Ansys are working together to provide clearance verification for the thermal and power integrity, as well as mechanical reliability of Intel’s integrated multi-die interconnect bridge assembly technology. These capabilities cover a range of use cases, from advanced silicon process nodes to various packaging platforms.
Juan Lee, vice president and general manager of Ansys’ electronics, semiconductors, and optics business unit, highlighted the collaboration between Ansys and Intel Foundry to address complex multiphysics challenges and meet stringent requirements for military and aerospace products. Suk Lee, vice president and general manager of the ecosystem technology office at Intel Foundry, welcomed Ansys as a valuable addition to the USMAG Alliance, emphasizing the ecosystem of partners that provide design and simulation capabilities.
Ansys’ mission is to drive innovation that advances human progress by using simulation software to bridge the gap between design and reality. With over 50 years of experience, Ansys software has enabled innovators in various industries to push boundaries and drive advancements in fields such as sustainable transportation, advanced semiconductors, satellite systems, and medical devices.
Overall, the collaboration between Ansys and Intel Foundry aims to develop thermal management technology for the Intel 18A silicon process to support HPC, graphics, and AI products for US national security applications. Ansys is leveraging its expertise in thermal resolution technology to provide predictive accuracy and system-wide analysis, enabling better performance and design flexibility in high-performance computing, AI, and graphics processor chips. Juan Lee and Suk Lee both emphasize the value of the collaboration in addressing complex challenges and meeting stringent requirements for military, aerospace, and government applications.
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