AMD spoke at the ongoing Computex 2021 about its jointly developed 3D chipset processor with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.

During the virtual event, AMD demonstrated the first application of 3D chiplet technology, a vertical 3D cache connected to an AMD Ryzen 5000 series processor prototype designed to provide significant performance gains across a wide range of applications.

AMD claims that its phototyped 3D chiplet delivers 200 times the connection density of 2D chiplets and more than 15 times the density of existing 3D packaging solutions. Thanks to the close cooperation with TSMC, the 3D chiplet technology from AMD also consumes less energy than current 3D solutions and, according to the provider, is the most flexible active-on-active silicon stacking technology in the world.

AMD said it is well on the way to starting production of future high-end computing products with 3D chiplets by the end of 2021.

In addition, AMD announced industry leaders Tesla and Samsung that it has expanded its adoption of its computing and graphics technologies to the automotive and mobile markets. The newly developed infotainment systems in the Tesla Model S and Model X are powered by AMD’s integrated Ryzen APU and a GPU based on the RDNA 2 architecture that enables AAA gaming. AMD is also working with Samsung on its next-generation Exynos SoC, which will feature a custom AMD RDNA 2 architecture-based graphics IP that provides variable rate ray tracing and shading capabilities for flagship mobile devices.

AMD also announced its new Ryzen processor offerings for enthusiasts and consumer PCs; leading data center performance with the latest 3rd generation AMD EPYC processors; and a whole host of new AMD graphics technologies for gamers.

“At Computex, we highlighted the growing adoption of our high-performance computing and graphics technologies as AMD continues to set the pace of innovation for the industry,” said AMD CEO Lisa Su. “With the introduction of our new Ryzen and Radeon processors and the first wave of AMD Advantage notebooks, we are building the third dimension of the ecosystem of leading AMD products and technologies for gamers and enthusiasts alike. Our first application of 3D chiplet technology at Computex demonstrates our commitment to pushing the limits of high-performance computing to significantly improve the user experience. “

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