By TradingView
Publication Date: 2026-10-27 05:00:00
Taiwan Semiconductor Manufacturing Co. (TSM) is preparing to raise prices for its advanced packaging process by 10%-20% as surging demand for AI chips strains production capacity, Taiwan’s China Times reported on Tuesday, citing supply-chain sources.
If it goes through with the plan, it would raise costs for several chip firms, including Nvidia Corp (NVDA) and Advanced Micro Devices (AMD). The move could also put further pressure on the prices of Apple’s (AAPL) iPhones and MacBooks, which have already seen price increases amid rising memory chip costs.
TSMC’s CoWoS Plan
TSMC is considering raising prices for CoWoS (Chip on Wafer on Substrate), its advanced packaging technology that integrates chips and high-bandwidth memory (HBM) into a single package.
The report says the potential hike is being considered as demand for advanced packaging expands beyond GPUs to server CPUs and custom AI chips or ASICs, leading to capacity constraints.
TSMC is continuing to ramp up its advanced packaging operations to meet demand, with monthly CoWoS capacity expected to exceed 130,000 units in 2026 and 200,000 units next year, China Times reported.
TSMC is the world’s largest contract chipmaker, making advanced chips that power everything from AI data centers to smartphones. Its major customers also include Broadcom, Qualcomm and MediaTek.
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