NVIDIA Secures TSMC A16 Node for Next-Generation “Feynman” GPUs

According to supply chain sources and those close to TSMC, NVIDIA is already working on prototyping the replacement for its “Rubin” and “Rubin Ultra” GPU designs with the next-generation “Feynman” GPU microarchitecture. As noted in the latest report from DigiTimes, NVIDIA is opting for TSMC’s A16 node, bypassing the N2 family of nodes entirely in favor of the more advanced 1.6 nm A16 design. Mass production is scheduled for the second half of 2028. The “Feynman” designs will rely on the backside power delivery in the A16 node, as well as on packaging technologies like 3D chiplets using SoIC, CoWoS-L 2.5D integration, and next-generation panel-level packaging.

Initially, NVIDIA will use SoIC 3D stacking technology to stack multiple chiplets into a single package, which will shorten the travel time between chips and reduce latency. These 3D chips will then be packaged side-by-side in a CoWoS-L or CoPoS packaging, creating a multi-kilowatt design capable of processing dozens of PetaFLOPS. For memory, NVIDIA will work with its partners to develop customized HBM, likely HBM4E, by the time “Feynman” reaches mass production. This customized memory includes a specialized base die that can contain logic elements like a memory controller or packet processing unit. Think of it as a way to pre-process data before it enters memory, or as a simple speedup, depending on what NVIDIA aims to achieve.

The final piece of the puzzle will be co-packaged optics (CPO), where NVIDIA will…