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  • Microsoft planning new AI chip bodes well for Marvell, TSM: Wedbush

Microsoft planning new AI chip bodes well for Marvell, TSM: Wedbush

vm_adminAugust 12, 2026
Microsoft planning new AI chip bodes well for Marvell, TSM: Wedbush

By Chris Ciaccia
Publication Date: 2026-08-11 11:40:00

Microsoft may unveil Azure Maia 300 this fall, seeking major TSMC capacity for 2027.

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Microsoft
Tagged bodes, chip, Marvell, Microsoft, planning, TSM, Wedbush

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