By Muhammad Zuhair
Publication Date: 2026-02-12 17:30:00
Samsung’s return to the HBM market is a sight to see, and according to the latest announcement, its HBM4 process offers blazing-fast speeds and is now commercially deployed.
Samsung’s HBM4 Reaches Up to 13 Gbps, Making It Ideal For Integration With Vera Rubin
The HBM industry is certainly seeing a shift in market dynamics, mainly in the distribution of market share among SK hynix, Samsung, and Micron. In particular, the race with the HBM4 technology has become much more competitive, and the Korean giant has improved its offerings by a huge margin. In the company’s latest post, Samsung has revealed that its HBM4 memory is one of the first to be “commercially” shipped, based on the 6th-generation 1c DRAM, and a 4nm logic die, all sourced internally.
One of the major benefits of Samsung’s HBM4 is that the technology is rated to have the fastest pin speeds, reaching 11.7 Gbps, which is 46% higher than 8 Gbps. The company claims to have reached 13 Gbps after overclocking, implying that Samsung has met one of NVIDIA’s key qualification requirements. More importantly, Samsung has also revealed that current solutions being shipped focus on a 12-layer approach, and that a 16-layer HBM4 memory is also in development, which would take per-module capacity to 48 GB.
While Samsung hasn’t revealed the exact customer that led to the customer deployment, we do know that the only infrastructure provider working on the memory technology is NVIDIA,…
