FIT bolsters Broadcom’s co-packaged optics initiatives

FIT bolsters Broadcom’s co-packaged optics initiatives

Foxconn Interconnect Technology has reaffirmed its commitment to supporting Broadcom’s co-packaged optics (CPO) initiatives, a transformative technology aimed at reducing signal loss and enhancing high-speed computing performance in data centers. This…



Article Source
https://www.digitimes.com/news/a20250514PD220/fit-broadcom-cpo-optics-performance.html